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CAUI-4 Chip-to-Module Compliance Kit

Test the compliance of simulation models and topologies to the CAUI-4 chip-to-module (C2M) specification.

This kit is designed for analysis of a host board and an optical module. The channel consists of a host board connected with a mated connector to a module board. The channels between the transmitting and receiving devices operate at 25.718 Gb/s. The kit has sheets for network characterization to analyze the passive channels (insertion and return). There are single channel sheets to analyze the effects of inter-symbol interference on performance. You can optimize TX and RX equalization and test compliance with a stressed eye. Multi-channel sheets represent the four 25 Gb/s channels to determine the effects of crosstalk on channel eye margin.

This kit enables you to insert a channel design and characterize and validate its performance using the specification masks to determine if the channel has a high confidence of success. If the channel does not meet the compliance masks or BER estimates, further investigation or redesign, along with simulation, will need to be performed to determine possible changes to meet compliance.

Open CAUI-4 C2M Kit

Open the CAUI-4 C2M kit in the Serial Link Designer app using the openSignalIntegrityKit function.



Kit Overview

  • Project Name: CAUI_4_C2M_83E_QSFP28

  • Interface Name: CAUI4_C2M_83E

  • Operating Frequency: 25.78 Gb/s (UI = 38.788 ps)

Schematic sheets are included for testing a CAUI-4 C2M channel with mated connector to a module board. The masks provided in this kit are given in the 28.05 Gb/s CAUI-4 specification.

For more information about the CAUI-4 C2M channel compliance schematics, transfer net properties and compliance rules, refer to the document CAUI4_C2M.pdf that is attached to this example as a supporting file.


[1] IEEE 802.3bm-2015 Specification. Annex 83E. 802.3bm-2015.pdf.

[2] IEEE 802.3bj-2014 Specification. Annex 92. 802.3bj-2014.pdf.

See Also